VVDN Technologies Provides World-Class PCB Assembly and Traceability for Electronics

VVDN Technologies, with its world-class manufacturing facilities, provides clients with full turnkey solutions for their products and production needs. The fully automated high-speed PCB assembly lines are capable of assembling complex boards with components including BGAs, uBGA’s, PLCC, FPGA, bare dies, flip chips, OSC, 3D Coplan, etc.

With scrutinized systems for batch production and component traceability, their PCB assembly process ensures the best quality of finished products for customers across the globe. Their PCB assembly has wide-class SMT line, solidity, and traceability for all electronics.

VVDN Technologies offers world-class SMT lines with Package-on-Package (PoP), specialized chip mounting, and fine-pitch, high-count BGA capabilities. These lines offer precision placement ranging from 01005 metric to 200 x 125 x 25 SMT to chip on board and accommodate PCB sizes up to 850 mm x 560 mm.

The facility uses functional testing, in-circuit test (ICT), and burn-in testing (BIT) in addition to in-line 3D AOI and 3D SPI for extensive inspection, high-speed multi-mounters with a total CPH of 693,500, and 2D/3D X-Ray Machines (AXI) for thorough testing and traceability.